If you recall, Google launched the Pixel 7 series in October of last year. And now, weâre in September, which means the Pixel 8 lineup is over the horizon. As we approach the launch date, more and more details about the device have been popping up. This time, itâs about the Google Tensor G3 SoC.
Iâve already made an in-depth coverage of the Tensor G3. In that, Iâve explained all the core differences that lie between the G3 and G2. In case you missed it, the main difference between the chipsets is that the new G3 comes with nine cores, while the G2 features an 8-core configuration.
Whatâs more important is that the additional core of the Tensor G3 is a Cortex-X3 super core. This automatically means that there will be a significant performance boost. But higher performance wonât mean anything if the chipset doesnât run cool. Well, Samsung Foundry, the chipset manufacturer of the G3, has taken proper measures in this regard.
Google Tensor G3 Incorporates FO-WLP For Better Thermals
The Tensor G3 chipset will be the first Samsung Foundry chipset to incorporate the FO-WLP packaging. For those wondering, FO-WLP stands for Fan-out water-level packaging. This enhanced water-level packaging gives chipsets better efficiency, improved performance, and, most importantly, lower thermals.
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That said, the Tensor G3 wonât be the first chipset to FO-WLP. Qualcomm and MediaTek, two of the leading chipset providers for smartphones, have been using the same packaging for quite a long time. But as mentioned earlier, the G3 will be the first Samsung Foundry chipset to utilize the packaging.
This will make the Tensor G3 run much cooler than the predecessor. And if youâve used one of the Pixel 7 devices, you may already know that the G2 SoC inside is pretty poor in terms of energy efficiency and thermals. Thankfully, the same wonât be true for the upcoming Pixel 8 series.
